Apple has announced a $30 billion multi-year deal with Broadcom to develop and produce custom silicon components and wireless connectivity technologies for its devices. The agreement, revealed on Wednesday, will result in the production of more than 15 billion U.S.-made chips and includes a $1.5 billion expansion of Broadcom’s Fort Collins, Colorado, facility. The deal extends through 2031 and covers the development of custom ASIC silicon products for multiple generations of Apple hardware.
Apple CEO Tim Cook emphasized the partnership’s role in advancing American manufacturing and innovation. 'The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect,' Cook said. Broadcom CEO Hock Tan noted that Apple’s financial backing will support the company’s growth in Fort Collins.
The agreement aligns with Apple’s broader American Manufacturing Program (AMP), launched in 2025 to bolster domestic production. The deal also reflects Apple’s previously disclosed $600 billion investment pledge to the U.S. economy over four years. Broadcom has long supplied Apple with connectivity components, and this new agreement deepens their collaboration around U.S.-made custom silicon.
The Trump administration has prioritized reshoring manufacturing and chip development, with policies supporting such initiatives. The White House has taken stakes in companies like Intel and OpenAI as part of its industrial and technology strategy.